Semiconductor chips, devices incorporating same and method of making same

摘要

A rectangular semiconductor chip is bonded onto a rectangular island at the center of a frame having a plurality of inner leads extending radially from the center. The chip has a plurality of pads adapted to be connected by wire bonding to corresponding ones of the inner leads. The pads are disposed sequentially along at least one side of the rectangular chip. Separations between mutually adjacent pairs of these pads along the side of the chip are smaller in the center part than in the end parts of the side such that the pads can be disposed closer together while preventing interference between mutually adjacent pairs of the bonding wires.