PRODUCT AND METHOD FOR PLACING GRANULATED BODY ON CONTACT PAD OF ELECTROONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a product to be used for placing a granulated body on a contact pad of an electronic device. SOLUTION: This product has a face having an array of adhesive sections 16 and non-adhesive sections 14. The adhesive sections 16 are formed so as to be flat with the non-adhesive sections 14 or placed below a flat face of the non-adhesive sections. One adhesive section 16 has the dimensions and connection strength just good enough for adhering one granulated body 20 to it. The product is used for transferring particles from the adhesive sections 16 onto contact pads of an electronic device such as a circuit board which is used in the application of semiconductor.