发明名称 BONDING UNIT
摘要 PROBLEM TO BE SOLVED: To make the bonding pressure adjustable accurately over a wide range, without needing of parts change, by canceling the self wt. of a bonding head by three magnets disposed so as to mutually repel, and using them for constituting a pressure source for the bonding pressure. SOLUTION: The bonding unit comprises a bonding head 31 for attracting a semiconductor pellet A, an arm 40 fixed to the head 31, a first magnet 44 horizontally mounted on the arm 40, a second magnet 45 mounted in a head holder 32 with their same poles opposed above the first magnet 44, and third magnet 50 mounted in the head holder 32 with the same poles opposed below the first magnet 44. The repulsion between the first and the third magnets 44, 50 cancels the self wt. of the bonding head 31 and the force between the first and the second magnets 44, 45 is a pressure source for the bonding pressure.
申请公布号 JPH10135250(A) 申请公布日期 1998.05.22
申请号 JP19960305731 申请日期 1996.10.31
申请人 SANYO ELECTRIC CO LTD 发明人 MUTO KENICHI;TOMIZAWA TERUYUKI;OOSAWA MASAAKI;NISHIO MIYUKI;ICHIKAWA YOSHIO
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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