| 摘要 |
PROBLEM TO BE SOLVED: To avoid seal resin cracking at low temps. during a temp. cycle loading, by providing an adhesive material contg. a thermosetting resin and thermoplastic resin for adhering a semiconductor element to a semiconductor element mounting member. SOLUTION: An adhesive material for adhering a semiconductor element 2 to a semiconductor element mounting member 1 includes a thermosetting resin 11 such as epoxy resin having a shape fit to the periphery of the semiconductor element 2. The resin 11 is made by cutting in advance a filmy epoxy resin 11 into pieces of specified shape using a die, and adhered to the semiconductor element mounting member 1 of a lead frame. A thermoplastic resin 12 is also formed into pieces of specified shape, the same as the thermosetting resin 11. The semiconductor element 2 is fed from above these resin being heated to improve the viscosity of the thermoplastic resin 12, thereby adhering the semiconductor element 2 to the mounting member 1 and fixed thereto. |
