| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device which can prevent cracking even when its package gets wet, and also to provide a method for mounting the device. SOLUTION: A resin-sealed semiconductor device 30 has outer leads 32 led out from a resin-sealed package body 31. The outer leads 32 are formed at their tip ends with openings 33. The semiconductor device 30 is positioned with respect to a substrate 41 which has projections positioned at the openings 33 in the tip ends of the outer leads 32, and pressed by a punching tool 51 having a punching recessed face to fixedly mount the semiconductor device 30 on the surface of the substrate 41. |
