| 摘要 |
The device consisting of semiconductor components (3, 10, 12, 13, 14) on circuit boards (2, 9, 11), has contact points of the components electrically connected on different circuit boards (2,9,11) via pins (4), pref. by plug- and/or spring contacts. At least one printed circuit board is pref. covered by a conductive compound which can be soldered. The printed circuit board is pref. covered by a layer of copper of 35 mu m thickness. Power semiconductors are covered on a side facing the respective circuit board, with a multi-layered metal which can be soldered.
|
| 申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
MAIER, REINHARD, DR.-ING., 91074 HERZOGENAURACH, DE;MITLEHNER, HEINZ, DR.RER.NAT., 91080 UTTENREUTH, DE;KALUZA, PETER, DIPL.-ING., 92266 ENSDORF, DE;SCHROETHER, GERHARD, DIPL.-ING., 92224 AMBERG, DE;SCHRECKINGER, CHRISTIAN, DIPL.-ING. (FH), 93444 KOETZTING, DE |
