发明名称 |
Wafer-level burn-in system |
摘要 |
<p>The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base. a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.</p> |
申请公布号 |
EP0841572(A2) |
申请公布日期 |
1998.05.13 |
申请号 |
EP19970308888 |
申请日期 |
1997.11.05 |
申请人 |
W.L. GORE & ASSOCIATES, INC. |
发明人 |
BUDNAITIS, JOHN J.;LEONG, JIMMY |
分类号 |
G01R3/00;H01L21/326;H01L21/66;G01R31/26;G01R31/28;G01R1/067;G01R1/073;(IPC1-7):G01R31/316 |
主分类号 |
G01R3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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