发明名称 PHENOLIC FOAM FOR VACUUM HEAT-INSULATING CORE MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To obtain a phenolic foam adaptable to a vacuum insulating material core which has an open-cell structure with a small average cell diameter and high open-cell percentage and can reveal excellent heat insulating performance by subjecting a foamed and hardened material made from a hardenable liquid phenolic resin to high-temperature heat treatment. SOLUTION: A foamable mixture obtained by uniformly mixing ingredients comprising, e.g. a hardenable liquid phenolic resin, a foaming agent, a foam stabilizer and, if necessary, a foam breaker, an agent for forming fine cells, and other additives is hardened while foamed to give a foamed and hardened material. This phenolic foam precursor is heat treated at 100-200 deg.C until the rate of decrease in weight reaches a constant (for 10min to 5hr). The obtained phenolic foam has a cell structure with an average cell diameter of less than 90μm and an open-cell percentage of at least 99.5%.</p>
申请公布号 JPH10120814(A) 申请公布日期 1998.05.12
申请号 JP19960297932 申请日期 1996.10.22
申请人 ASAHI ORGANIC CHEM IND CO LTD 发明人 OKUMURA SHUJI;MATSUSHITA KOJU;AWANO SHIGETOSHI;KAI ISAO
分类号 F16L59/06;B29C69/00;C08J9/04;C08J9/36;(IPC1-7):C08J9/04 主分类号 F16L59/06
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