AN ULTRASONICALLY MOUNTED PIEZOELECTRIC DEVICE AND METHOD OF MAKING SAME

摘要

A method and device for mounting a piezoelectric element in a package without the use of adhesives. The piezoelectric device includes a substrate (104) with at least two electrical traces (118), a piezoelectric element (102) with a top electrode (108) and a bottom electrode (106), and a wirebond ball bump (100). The ball bump is ultrasonically bonded to one of the electrical traces (118) on the substrate (104), and the bottom electrode (106) of the piezoelectric element (102) is ultrasonically bonded to the ball bump (100). A wirebond (110) connects the top electrode (108) with the remaining electrical trace (118) of the substrate (104). The device is provided in a conventionally sealed package.