| 摘要 |
<p>The invention concerns a method for producing an electrical component (10) consisting of a plurality of circuits (16, 18, 20, 22; 40, 42, 44, 46) printed on a corresponding plurality of flat insulating substrates (12, 14; 30, 32; 34, 36) stacked on one another to form a multilayered monolithic wafer, the printed circuits being mutually connected. The substrates are separated from one another by an insulating material (24), and each of the printed circuits having at least one zone for connection (50, 52, 54, 56, 58, 60) to at least another printed circuit, the connecting zones of two circuits to be mutually electrically connected being substantially in straight line with each other for being bored by a hole (70) for the passage of an electric conductor. The holes (70) are bored over the whole thickness of the wafer after the substrates have been stacked.</p> |
