发明名称 Apparatus for vacuum line cleaning in substrate processing equipment
摘要 An apparatus for minimizing deposition in an exhaust line of a substrate processing chamber. The apparatus (40) includes first and second electrodes (56,58) having opposing surfaces that define a fluid conduit (54) between them. The fluid conduit includes an inlet (50), an outlet (52) and a collection chamber between the inlet and the outlet. The apparatus is connected at its inlet (50) to receive the exhaust of a substrate processing chamber. The collection chamber is structured and arranged to collect particulate matter flowing through the fluid conduit and to inhibit egress of the particulate matter from the collection chamber. A plasma generation system (102) supplies power to the electrodes to form a plasma from etchant gases within the fluid conduit. Constituents from the plasma react with the particulate matter collected in the collection chamber to form gaseous products that may be pumped out of the fluid conduit. The apparatus may further include an electrostatic collector (100) to enhance particle collection in the collection chamber and to further inhibit egress of the particulate matter. <IMAGE>
申请公布号 EP0839930(A1) 申请公布日期 1998.05.06
申请号 EP19970308660 申请日期 1997.10.29
申请人 APPLIED MATERIALS, INC. 发明人 PANG, BEN;CHEUNG, DAVID;TAYLOR, WILLIAM N., JR.;RAOUX, SEBASTIEN;FODOR, MARK
分类号 B03C3/02;B01D45/06;B01D53/32;B01D53/46;B01J19/08;B01J19/12;B01J19/24;C23C16/44;H01J37/32;H01L21/205;H01L21/31;H05H1/24 主分类号 B03C3/02
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