| 发明名称 |
Method of forming a semiconductor device |
| 摘要 |
A surface (13) of a semiconductor wafer (11) is sandblasted in order to remove material and form trenches (19) in the surface (13). A sandblasting resistant mask (14) is used to mask the surface (13) during the sandblasting operation. <IMAGE> |
| 申请公布号 |
EP0840364(A1) |
申请公布日期 |
1998.05.06 |
| 申请号 |
EP19970117871 |
申请日期 |
1997.10.15 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
SNIDER, TODD D. |
| 分类号 |
B24C1/04;B24C11/00;G03F7/12;H01L21/304 |
主分类号 |
B24C1/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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