| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer printed wiring board for mounting IC, which can firmly fix a heat sink to its laminate side by means of adhesive or soldering. SOLUTION: A laminate 12 is heated at a temperature of 200 deg.C for one hour to be warped. Thereafter, the laminate 12 is heated in a reflow furnace at a temperature of 150 to 180 deg.C for 4 or 5 minutes to set an adhesive 72 made of thermosetting resin to fix a heat sink 46 on a conductor circuit 14a, heated to 240 to 250 deg.C for the last 5 or 10 seconds to melt a solder 74, thereby establishing a connection between a chip capacitor 76 and a conductor circuit 14b. Since warpage is previously given to the laminate by heating, warpage caused by heating to 240 to 250 deg.C in the reflow furnace can be minimized.</p> |
