| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for soldering a work with bump on the pad of the work with satisfactory conduction, so that a solder bridge does not occur without using flux. SOLUTION: A work 1 with bump is vacuum-sucked to a head and a bump 2 is pressed to a solder part 12 on a pad 11 of a work 10. Then, a projection part 3 of the bump 2 partially destroys an oxide film 15 and is abutted on the melted solder part 12. Then, it settles down on the pad 11. Then, the melted solder part 12 is cooled and solidified, and the bump 2 is bonded on the pad 11. Since the oxide film 15 covers the surface of the solder part 12 as a hard shell, the solder of the solder part 12 does not flow to a side, even if the bump 2 is pressed against strongly, and a solder bridge does not occur.</p> |
