| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to secure electric conductance with an electrode of a circuit substrate without exposing externally or without processing a lead, by exposing the tip of the lead almost flush with a surface of a main body of resin constituting a package main body. SOLUTION: A lead frame 11 is folded and processed to a shape having level difference at a middle portion between an inner lead 12 and an outer lead 13. Next, a resin main body 15 is formed for the lead frame 11. As a result, the middle portion of a lead frame 11 is embedded in the resin main body 15, the inner lead 12 is exposed to a hollow portion of a resin main body 15, and, moreover, the tip of the outer lead 13 is exposed externally with its bottom surface almost flush with the outer bottom surface 18 near the peripheral edge of the outer bottom surface 18 constituting one surface of the resin main body 15. By doing this, handling is made easier when mounting to a circuit substrate, the accuracy of folding process of the lead can be maintained to a higher level compared to the technique of folding the lead after forming resin main body, and a pushing force to the resin main body is no more required.</p> |
