Heat-aging-resistant polyamide resin composition and fiber comprising the same

摘要

There are provided a heat-aging-resistant polyamide resin composition comprising (C) a polyamide containing 10 to 100 % by weight of (A) a polyamide obtained by polymerizing a monomer containing 70 mole % or more of m-xylylenediamine as a diamine component and a monomer containing 70 mole % or more of adipic acid as a dicarboxylic acid component and 90 to 0 % by weight of (B) other polyamide, (D) a copper compound in an amount of 0.001 to 0.1 part by weight per 100 parts by weight of the polyamide (C), (E) a halide of a Group 1 or Group 2 metal of the Periodic Table of the Elements, an ammonium halide, or an organohalide in an amount of 0.005 to 1 part by weight per 100 parts by weight of the polyamide (C), at least one selected from among (F) hindered phenols and (G) hindered amines with the amount of each of the hindered phenols (F) and the hindered amines (G) being 0.05 to 3 parts by weight per 100 parts by weight of the polyamide (C), and (H) an organophosphorus compound in an amount of 0.05 to 3 parts by weight per 100 parts by weight of the polyamide (C), and a high-Young's modulus heat-aging-resistant polyamide fiber comprising said polyamide resin composition and having a Young's modulus of 400 kgf/mm<2> or more which has an excellent durability, such as a heat-aging-resistance under high-temperature conditions.