发明名称 |
Grounding clip for IC cards |
摘要 |
An IC card kit adapted for receiving a circuit board assembly, which assembly includes a generally planar circuit substrate with an electrical circuit and electrical components mounted on a surface thereof. The electrical circuit includes a ground circuit. The kit includes a frame adapted for receiving the circuit board assembly, a receptacle connector for mounting at the edge of the assembly, a pair of cover panels for sandwiching the frame and circuit board assembly, and a conductive grounding clip on the frame for engaging the ground circuit of the circuit board assembly. The clip includes a spring arm for preassembling the circuit board assembly to the frame.
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申请公布号 |
US5747735(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19970812182 |
申请日期 |
1997.03.06 |
申请人 |
MOLEX INCORPORATED |
发明人 |
CHANG, WEI-SUN;CHEN, LIU-YUAN |
分类号 |
G06K19/077;B42D15/10;G06K17/00;G06K19/07;H01R12/18;H01R13/648;H01R13/652;H05K5/02;H05K9/00;(IPC1-7):H05K5/02 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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