| 摘要 |
In order to obtain a miniature unit having a simple structure which can operate at a high speed at a low cost, a copper pattern (225) provided on a power substrate (221) having a DBC substrate structure is exposed on an outer surface of the unit. Thus, it is possible to discharge heat which is generated in a main circuit of the unit to the exterior without providing a copper base plate by mounting the unit so that the pattern (225) is directly in contact with an external heat slinger or the like. The power substrate (221) is not deformed following its temperature change, since no copper base plate is required. Thus, no S-bent structure is required for a terminal which is connected with the circuit or the like, whereby speed increase and miniaturization are enabled, while the structure is simplified since no silicone gel is required.
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