发明名称 |
Vertical channel masked ROM memory cell with epitaxy |
摘要 |
A device and a method of manufacture of a semiconductor device on a semiconductor substrate is provided. An N+ source layer is formed on the surface of the semiconductor substrate. A dielectric layer is formed on the surface of the source layer. The dielectric layer is patterned and etched forming a dielectric layer pattern with openings therein, a silicon epitaxial layer in the openings in the dielectric layer pattern. An N+ drain layer is formed on the surface of the silicon epitaxial layer. A second dielectric layer is formed on the surface of the device including the N+ drain layer. A conductor layer is formed and patterned containing silicon over the second dielectric layer. An N+ implant mask with an N+ opening over a region of the epitaxial layer is formed (source) and ion implanting through that N+ opening into the N+ implant mask in that region. A code implant mask over the conductor layer is formed and ions are implanted through the code implant mask into the device.
|
申请公布号 |
US5747856(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19970827633 |
申请日期 |
1997.04.10 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
CHEN, LING;HSU, SUNG-MU;FANG, WENG LIANG |
分类号 |
H01L21/8246;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113 |
主分类号 |
H01L21/8246 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|