Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul

摘要

Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling surface is provided by a metal-ceramic composite material with a thermal expansion coefficient corresponding to that of the sub-modules, the interior of the housing containing additional means for increasing the heat transfer between the cooling surface and the cooling fluid.