SPUTTERING DEVICE

摘要

PURPOSE:To sputter a thin film having a uniform thickness over the entire surface of a substrate by providing a specifically shaped target cover to which the same voltage as the voltage on the substrate is kept impressed between the target of a sputtering device and the substrate to be sputtered. CONSTITUTION:A substrate holder 6 which is an anode and the substrate 7 attached thereto are disposed in a sputtering chamber 1 and the target 5 of the material to be sputtered is placed on a target electrode 8 which is a cathode, apart from a shutter 2. The target cover 10 which has the same potential as the potential of the anode 6 and consists of a metallic plate 11 having differently sized holes 12 for passage of sputtering particles is disposed above the target 5 apart at 0.3-1cm. A magnet 4 is attached thereto to form a magnetic field on the surface of the target electrode 8. The sputtering particles released from the target 5 are made uniform in the velocity to the substrate 7 over the entire surface by the preence of the holes of the cover 10 so that the film having a uniform thickness is sputtered on the substrate 7. The cover 10 consisting of metallic wires 13 or of a comb-line 16 may be used as well.