HIGH HEAT CONDUCTIVITY ALUMINIUM NITRIDE CERAMIC

摘要

The ceramic is used for microcircuit, high density integratedcircuits and radio technical instrument substrates. Finecrystalline microstructure of 3 m of the ceramic, high densityof 3.35-4.0 g/cm3 and, as a result of the low 02 content (under1.5%) - high value of the heat conductivity of from 260 to 300W/m.k. is achieved by means of the method for hot pressing usingthe composition and the method for producing ceramics fromaluminium nitride by the addition of SrC12.6H20 and the method ofhot pressing.1 claim