| 发明名称 |
Metal-base multilayer circuit substrate |
| 摘要 |
A metal-base multilayer circuit substrate which comprises a metal plate and a circuit substrate bonded thereon by means of a first insulating adhesive layer containing at least one of metal oxides and/or at least one of metal nitrides. <IMAGE> |
| 申请公布号 |
EP0738007(A3) |
申请公布日期 |
1998.04.29 |
| 申请号 |
EP19960105663 |
申请日期 |
1996.04.10 |
| 申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
SAITOH, TOSHIKI;YONEMURA, NAOMI;MIYAKOSHI, TOMOHIRO;FUKUDA, MAKOTO |
| 分类号 |
H01L23/14;H05K1/02;H05K1/05;H05K1/18;H05K3/00;H05K3/30;H05K3/46 |
主分类号 |
H01L23/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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