| 摘要 |
In a power semiconductor module (10), in which a plurality of individual controllable power semiconductors in the form of semiconductor chips (13, 15, 16) are arranged alongside one another and electrically connected on a common module substrate (11), electrical connection to the surroundings with an appreciable reduction in the required surface area of the module or substrate is achieved by virtue of the fact that the control connections (23-25) of a plurality of the controllable power semiconductors are brought together on a second plane which is vertically offset with respect to the plane of the module substrate (11).
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