MOLD DEVICE, GATE CUTTING, AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the efficiency of cutting of a residual resin formed in a resin passage such as a gate. SOLUTION: A residual resin 16b to be formed in the gate, flow cavity and resin reservior of a mold is formed in such a manner that the cross section shape of the resin in a mold-mating direction is rhombic, when resin moldings are made. After that, the residual resin 16b is cut with the help of a punch 20 by applying a load to the residual resin 16b formed by the flow cavity in the twisting direction and twisting the part near the base of the residual resin 16b.