| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for a BGA semiconductor device, which reforms the warp occurring in the ball grid array(BGA) semiconductor device and attains favorable electric connection. SOLUTION: In the case of mounting a BGA semiconductor device 1 on a mounting board 2 by this method, adhesives 11, a little higher than the level of a solder bump 10, to join the four corners, at least, of the BGA semiconductor device with the mounting board 2 are made. Then, after hardening of this adhesive 11, heat-treatment is applied to it, with this a supporting pole, and the solder bump 10 is reflowed. At this time, the warp going to occur by heat- treatment is reformed by the adhesive 11, so the mounting without influence of a warp can be performed. |
