发明名称 |
Method for forming a thin film and apparatus of forming a metal thin film utilizing temperature controlling means |
摘要 |
In an aparatus for forming an aluminum thin film, or an aluminum alloy thin film useful to an interconnecting material of an electronic device, there are provided: a processing chamber capable of keeping a vacuum condition therein; a substrate holder mounted within said processing chamber, for holding a substrate and performing a temperature adjustment; a first temperature adjusting mechanism for performing the temperature adjustment of said substrate via said substrate holder; a gas conducting mechanism for conducting a predetermined gas into said processing chamber; an exhausting mechanism for exhausting an interior of said processing chamber; a distributing plate provided within said processing chamber, for uniformly supplying said predetermined gas to a surface of said substrate; whereby a part of element consisting said predetermined gas is deposited on the surface of said substrate; and a second temperature adjusting mechanism for adjusting the temperature of said distributing plate.
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申请公布号 |
US5744377(A) |
申请公布日期 |
1998.04.28 |
申请号 |
US19950561747 |
申请日期 |
1995.11.22 |
申请人 |
ANELVA CORPORATION |
发明人 |
SEKIGUCHI, ATSUSHI;KOBAYASHI, TSUKASA;TAKAGI, SHINJI |
分类号 |
C23C16/20;C23C16/44;C23C16/452;C23C16/455;H01L21/285;H01L21/768;(IPC1-7):H01L21/44 |
主分类号 |
C23C16/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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