| 摘要 |
PROBLEM TO BE SOLVED: To prevent a resin from flowing to an element mounting face in a resin molding operation by a method wherein gaps between leads in a molding region at a lead frame are filled with the resin in advance so as to be hardened, the gaps between the leads are blocked up, a lid is put on an element and the opening edge of the lid is bonded and fixed to the lead frame. SOLUTION: In a resin-molded electronic component, an element 1 is placed on an electrode part 2a in the center, electrodes on the element 1 are connected to an input lead part 2b, an output lead part 2c and a grounding conductor 2d in the center by means of bonding wires 6, the opening edge 5c of a lid 5 of a one-face opening structure is bonded to faces, on one side, of the conductors 2 so as to cover the element 1, and the lid 5 as well as the front and the rear of the conductors 2 in its peripheral region are molded with a resin. Thereby, it is possible to prevent a molding resin from creeping to an element mounting face on the lid mounting side in a molding operation, and it is possible to prevent the molding resin from being stuck to the element. In addition, when gaps between leads at a lead frame are blocked up by the resin, the element mounting face can be made uniform.
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