| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layered wiring board, which can suppress characteristic deterioration of insulating layers or viahole conductors caused by an etching solution or plating solution and also can process its circuit microfinely and can satisfy its microfine processing demands, and also provide a method for manufacturing the wiring board. SOLUTION: The multi-layered wiring board includes insulating layers 1 containing at least organic resin, wiring circuit layers 2 disposed on the surface and interior of each of the insulating layers 1, and viahole conductors 3 for electrically connecting between the wiring circuit layers 2. Formed on the insulating layers 1 are the wiring circuit layers 2, on which insulating layers are formed, the insulating layers are formed therein with viaholes, and then the viaholes are filled with conductive paste to thereby form viahole conductors 3. And a wiring circuit layer made of a metallic foil is formed a location where the viahole conductor is formed by transfer of a transfer sheet, the above process is repeated to form a laminate of such wiring circuit boards, and in particular both ends of the viahole conductors 3 of the conductive paste are sealed with the wiring circuit board 2. |
