发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To obtain the length of a tab lead necessary for bending work, and to prevent a wire from being brought into contact with a semiconductor element by forming the lead in parallel with the body face of a package from which external leads are not extended. CONSTITUTION:A tab lead 6 is extended from one end of a tab 2, disposed in a direction parallel to the side face 71 of a package body 7 from which external leads 4 are not extended, and a bent part 61 is formed. Since the lead 6 constructed in this manner can be increased in length as compared with the lead of a linear shape, a part parallel with the side face 71 of the body 7 can be bent.</p>
申请公布号 JPH01308055(A) 申请公布日期 1989.12.12
申请号 JP19880139656 申请日期 1988.06.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 MICHII KAZUNARI
分类号 H01L23/28;H01L23/50 主分类号 H01L23/28
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