Method of manufacturing resistive elements on circuit board

摘要

The method is used to form resistive elements in the form of resistive tracks on a carrier plate or circuit board. The method involves applying the conductive tracks onto the circuit board (10). The resistive tracks (21,22,23,24) are then applied to the circuit board (10). The method then involves separating the resistive elements (20) by cutting or milling. The conductive tracks may be applied by galvanising, sputtering, chemical etching or printing. The resistive tracks may be formed by spraying or printing or by screen printing.