| 摘要 |
PROBLEM TO BE SOLVED: To provide the method and device for monitoring a plating process by which a warning is issued to an operator when the condition necessary for appropriate palladium plating becomes inappropriate to form a desired palladium layer or the production is automatically stopped by optional selection. SOLUTION: A first current 30 is applied to a first plating cell 18 to form a nickel deposit on a lead frame 12, a second current is applied to a second plating cell 19 to form a palladium deposit on the nickel deposit. When a plating device 10 is normally operated, the second current 31 is greater than the first current 30. While the first current 30 and second current 31 conduct plating, comparison is made by a comparator 44, an error signal is generated in an output line 50 when the second current 31 is smaller than the first current 30. The plating device 10 is stopped, as desired, in response to the error signal. |
