| 摘要 |
A molding die has a plurality of cavity groups each occupying four corners of a rectangular area for accommodating semiconductor chips mounted on a lead-frame, pots each occupying a central area of the rectangular area and a plurality of runner groups each having straight runners equal in length and connecting the pot to the cavities in the four corners, and molten resin concurrently reaches the cavities in the four corners so as to produce semiconductor devices without non-filling or partially filling cavity.
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