Halbleitergerät mit Spannungsbelastungskontaktfläche

摘要

An semiconductor device includes an integrated circuit having first and second circuit sections formed on a semiconductor chip (10), at least one voltage stress testing pad (11, 12) formed on the semiconductor chip, for supplying a voltage stress testing voltage or signal to the first circuit section, and a control circuit (15) formed on the semiconductor chip, for controlling and setting the second circuit section into a state corresponding to a voltage stress testing mode by using an input from the voltage stress testing pads.