METHOD AND APPARATUS FOR SPIN COATING METHOD

摘要

A spin coating apparatus and method thereof is provided to improve uniformity of coating film. The spin coating apparatus comprises: a table(21) for rotating; a rotation axis(22) located on the table(21); a coating solution applying means for emitting the coating solution to the surface of the wafer(20) and formed on the table(21); and a solvent applying means(29) for emitting the solvent to dissolve the coating solution and formed on the table(21). Thereby, it is possible to easily coat of uniform coating film at the time of a small quantity of the emitted coating solution.