| 摘要 |
PROBLEM TO BE SOLVED: To reduce packed components to allow them to be micromachines by placing bonding pads at outside of a protective cover, electrically connecting them to devices in a semiconductor substrate, and providing cavities for hermetically sealing and holding the devices in the substrate with the cover. SOLUTION: A wafer 200 is covered usually with a silicon dioxide insulating layer 236. Contact pads 250 electrically, connected to air bridge conductors 242, are exposed through openings 248 of appropriate dielectric. The conductors 242 are formed in regions of air bridge cavities 241 in a substrate 202, connected to the pads 250, and supported by the layer 236. An Si cover wafer 260 has an Si layer 261 and insulation layer 262. Cavities 263, 264, 265 are formed by a mask and etching. The cavities 263, 265 correspond to top openings of 248 of the pads 250, and cavity 264 corresponds to the air bridge hollow 241. |
