发明名称 REPROCESSIBLE PHOTOSENSITIVE CAPSULE MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting compd. which is cured by the exposure to chemical rays and is useful as a reprocessible capsule material for integrated circuits by compounding a specific acetal diepoxide with a photo/acid-generated photoinitiator. SOLUTION: This material is an uncured thermosetting compd. which is cured by the exposure to chemical rays and contains an acetal diepoxide represented by the formula [wehrein R and R' are each an aliph. or alicyclic epoxy part; R1 to R4 are each alkyl, substd. alkyl, aryl, or aralkyl; and R2 and R3 are each H, alkyl, alkoxy, substd. alkaryl, alkaryl, or cycloalkyl] and a photo/acid generated photoinitiator. The compd. may further contain a second epoxy-functional resin, an inorg. filler, a plasticizer, etc. A cured capsule material contg. the compd. is dissolvable in a dil. acidic soln. and can be recycled.
申请公布号 JPH1095833(A) 申请公布日期 1998.04.14
申请号 JP19970183448 申请日期 1997.07.09
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 KUCZYNSKI JOSEPH PAUL;MULHOLLAND LAURA MARIE
分类号 C08K3/18;C08F2/46;C08G59/18;C08G59/20;C08G59/22;C08G59/24;C08K3/30;C08K3/36;C08K7/16;C08L63/00;G03F7/038;H01L23/29;H01L23/498;(IPC1-7):C08G59/20 主分类号 C08K3/18
代理机构 代理人
主权项
地址