CONTACT MANUFACTURING OF SEMICONDUCTOR DEVICE

摘要

It provides a profitable contact manufacturing method for high-integrated device and enlarges process margin, by forming multi mask layers on a interlayer isolation film, eliminating more mask layers' areas than the preset areas for contacts of the interlayer isolation film, and, by sequentially forming spacers, arranging the whole contact hole size as a self aligning to form micro contacts beyond the size of the mask process limit.