| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a semiconductor device which has the same function as that of the conventional CSP(chip size package) type semiconductor using a TAB(tape automated bonding) board as an interposer and corresponds to the downsizing of a semiconductor device by using the conventional equipment, without adopting new production equipment and jigs. SOLUTION: A lead frame is provided with a first conductor circuit pattern 17, comprised of a plurality of conductor leads which are formed through press machining or etching of metallic bar, a second conductor circuit pattern 20 and a conductor circuit pattern 21 formed of support leads, and a piece of an insulating member 14 is fixed to the lead frame. Further the pattern 17 is provided to one side thereof and the pattern 20 to the other side thereof respectively, forming an integrated circuit element mounting board 22 with double-layer structure. Then an integrated circuit element is mounted to the board 22, and the main surface of the semiconductor element and the pattern 17 is packaged with resin, so as to form a semiconductor device. |
