| 摘要 |
<p>Two covered wires (W1,W2) conductively connected are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips (13,15). By melting cover portions and pressing resin chips from outside, the conductive wire portions (1) of the covered wires are conductively contacted with each other at the connection portions. The pair of the resin chips (13,15) are melt-fixed to each other to seal the connection portions. A crossing angle &thetas; of the two covered wires (W1,W2) at the connection portion is set to not less than 45 DEG to not greater than 135 DEG . Thus, the covered wires can be conductively connected with each other at cheap price easily. Further, a connecting state having an excellent electrical characteristic can be obtained stably.</p> |
