| 摘要 |
The epoxy resin composition to decrease a package crack for sealing semiconductor element was prepared. The epoxy resin composition is composed of 8-15 wt.% of epoxy resin obtained from formula I, II, III, IV, V, Vi, 5-10 wt.% of a phenolic resin hardener having a softening point of 70-80 deg.C and 130-150 equivalents of hydroxy group, 0.1-1.0 wt.% of hardening accelerator composed of triphenyl phosphin and DBU, 75-85 wt.% of inorganic fillers such as high-purity molten silica, synthesized silica powder, crystalline silica, alumina, etc, 0.3-1.0 wt.% of coupling agents such as silane compounds having epoxy or amine group, 0.5-3.0 wt.% of reformers such as epoxy, amine, phenol, carboxyl modified polysiloxane oil or CTBN compound, 2.0-5.0 wt.% of flame retardants such as brominated novolac epoxy resin, brominated bisphenol A type epoxy resin, antimony trioxide, and antimony pentoxide, 0.5-1.0 wt.% of releasing agents such as natural wax, synthetic wax or high purity carbon black, and 0.3-0.5 wt.% of a coloring agent.
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