发明名称 POLISHING DEVICE AND ITS CONDITIONER
摘要 PROBLEM TO BE SOLVED: To prevent dents from being formed in a polishing pad by arranging an elastic member between a conditioning member attached to a support body and the support body. SOLUTION: A pad conditioner 102 incorporates respective conditioning members 24, the bottom face 20 of a conditioning member support body 16, and elastic members 60 sandwiched between them, respectively. The respective conditioning members 24 and the elastic members 60 are arranged, for example, along the circumference of the bottom face 20 of the conditioning member support, body 16. The respective elastic members 60 minimizes unstable movement of the pad conditioner device and minimizes dents produced on the polishing pad. Especially, the elastic members 60 function as a damper to stabilize the movement of the pad conditioner and consequently wafers can be polished uniformly.
申请公布号 JPH1086057(A) 申请公布日期 1998.04.07
申请号 JP19970141904 申请日期 1997.05.30
申请人 TOSHIBA CORP;EBARA CORP 发明人 YANO HIROYUKI;OKUMURA KATSUYA;KIMURA NORIO;SHIMIZU NOBU
分类号 B24B53/007;B24B53/017;B24B53/12;H01L21/304 主分类号 B24B53/007
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