| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photocurable resin composition which can give a cured product having an excellent heat resistance by mixing a compound having a cyclohexene oxide structure with a cationic photopolymerization initiator, an ethylenically unsaturated monomer, a radical photopolymerization initiator and spherical silica particles. SOLUTION: 5-60wt.% 3,4-epoxycyclohexylmethyl-3',4'- epoxycyclohexanecarboxylate, 0.1-10wt.% cationic photopolymerization initiator (e.g. hexafluoroantimonate), 1-30wt.% ethylenically unsaturated monomer (e.g. trimethylolpropane triacrylate) and 0.01-8wt.% radical polymerization initiator (e.g. 1-hydroxycyclohexyl phenyl ketone) are fed into an agitating vessel and agitated at about 50 deg.C for about 2hr to obtain a homogeneous resin solution. This solution is mixed with 40-80wt.% spherical silica particles having a mean particle diameter of 1-50μm to obtain a photocurable resin composition having a viscosity of 1,000-10,000cP. This composition is molded and cured by irradiation with light to obtain a cured product having a heat distortion temperature of 100 deg.C or above.
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