CIRCUIT BOARD AND PRODUCTION METHOD THEREOF

摘要

A circuit board including IC connection electrodes and electrodes for connection with a mother substrate formed by disposing a conductor pattern on an insulating substrate, and capable of simplifying a production process without a bonding process between the film-like insulating substrate and the conductor pattern. In the circuit board (13) of this invention, a copper foil conductor circuit (5) is formed between polyimide layers (2, 6). Bumps (8) for IC connection and bumps (9) for connecting a mother substrate are disposed on the conductor circuit (5). The polyimide layers (2, 6) are formed by heating polyamide acid layers (2a, 6a) as the precursor of the polyimide at around 350 DEG C to terminate the imidation reaction.