| 摘要 |
PROBLEM TO BE SOLVED: To improve peel-off operation of a protective sheet from a semiconductor wafer by a method in which the contact area of a protective sheet with a semiconductor wafer is reduced, and air is made to flow easily. SOLUTION: A semiconductor wafer protective sheet 4 is formed in the rolled polyethylene sheet. Before the wafer protective sheet 4 is punched out from the rolled polyethylene sheet with a die conforming to a pattern prescribed in external shape and dimension, a polyethylene sheet is rolled by a great roller whose outer surface is embossed corresponding to projections 7 provided to the protective sheet 4. A gap is formed by the projections 7 between a semiconductor wafer 5 and a semiconductor wafer protective sheet 4 when the semiconductor wafers are housed in a semiconductor cassette 1. By this setup, a semiconductor wafer can be prevented from coming into close contact with a protective sheet 4. |
