| 摘要 |
PURPOSE:To obtain the subject composition, containing an epoxy resin, novolak type phenolic resin and respective specific amounts of a phosphazene-based fluororubber and inorganic filler and excellent in adhesion to semiconductor chips or lead frames with hardly any influence of moisture absorption. CONSTITUTION:The objective composition containing (A) an epoxy resin(e.g. a bisphenol type aromatic resin), (B) a novolak type phenolic resin, (C) 0.1-5wt.% phosphazene-based fluororubber expressed by the formula (R<1> is CpH2pCqF2q+1; R<2> is CtH2tCsF2s+1; l, m, n, p, q, s and t are >=1) and (D) 25-90wt.% inorganic filler (preferably silica powder or alumina powder). |
