| 摘要 |
This invention concerns a device for mounting electrical and electronic components (17) on printed circuit boards or hybrids (7) with different thermal expansion characteristics. The component (17), for instance, out of high-alumina ceramics, has several connecting pins (11) as connecting and mounting elements. These pins are butt-soldered with a conductor path (5) of the component (17). Each connecting pin (11) has a number of recesses (15) in its upper part. The form and arrangement of these recesses (15) effects a certain freedom of movement in all directions for the upper end of the connecting pin (11). This permits compensation for differences in the thermal expansion between component (17) and circuit board (7) and deviations from standard dimensions of both parts resulting from the production. Thus, the connecting pins (11) can be directly soldered into plated throughholes (10) in the circuit board (17). |
