Production of directly printed circuit board-mounted, wire-bonded optical diodes with encapsulation

摘要

This novel method is used to makes an electronic component, in which at least one electronic device (1), e.g. a semiconductor chip and especially a light-emitting diode semiconductor, is fastened to a prepared substrate (2) and equipped with a casing. Steps in this new procedure include deposition of a light-hardening layer (4) onto the substrate and completely over the open upper surface (5) of the device. This is subjected to electromagnetic radiation, such that local hardening forms a casing. The locations not hardened, are removed. Also claimed is the production of optical diode pairs, each chip having front and rear contacts.