| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket having favorable contact performance, and excellent electric characteristics. SOLUTION: A base 41 is disposed on one surface side of a printed wiring board 21 having contact electrodes 22 arranged and formed on one surface at the same pitch with an arrangement pitch of IC bumps, and terminal electrodes 23 respectively connected to the contact electrodes 22 formed on the other surface at an enlarged pitch. A through hole 31 having a conductive film 47 on an inner circumferential surface is provided on a bottom surface of a recess 29 of the base 41 to face the contact electrode 22, and a coil contact 33 is disposed in the through hole 31 to compose a contact part with the IC bump. The coil contact 33 is pressed by the IC bump to get in contact with the conductive film 47, so the conductive film 47 functions as a connection conductor to reduce a connection resistance value. |
