| 摘要 |
A silicon chip(1) is attached on the lead frame having the die paddle(4), an insulating film(5) being attached on the silicon chip(10), the bus bar(6) being attached on the insulating film(5). When bonding, Vcc or Vcc bond pad(7) is aligned in a short side or a long side, among a plurality of them one or two being bonded to an outer lead(2) and the rest of them being bonded to the bus bar(6), maintaining the same Vcc. Finally, molding is performed, forming a package.
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